Effects of rapid solidification process and 0.1%Pr/Nd addition on characteristics of Sn-9Zn solder alloy and interfacial properties of Cu/solder/Cu joints
赵国际 文光华 盛光敏 景彦霞 · 2016
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期刊名称:
Journal of Central South University   2016 年 08 期
摘要:
Rapidly solidified Sn-9Zn-0.1Pr(/Nd) alloy foils were prepared by melt-spinning method. Through comparison, the effects of rapid solidification process and 0.1%Pr/Nd(mass fraction) addition on the microstructure, thermodynamic characteristic of Sn-9Zn ...
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