Fabrication of conductive soybean protein fiber for electromagnetic interference shielding through electroless copper plating
期刊名称：
Journal of Materials Science: Materials in Electronics
2016 年
摘要：
We report on a simple but efficient strategy for the preparation of conductive soybean protein fiber (SBPF) by electroless copper plating method. The proposed method mainly composed of three procedures, namely, 3-aminopropyltrimethoxysilane (APTMS) modification, Cu
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